Coupling Path Influence on the Conducted Emission Measurement Results by the Emc Semiconductor Test Board : Volume 9, Issue 23 (01/08/2011)

By Frick, M.

Book Id: WPLBN0003974191
Format Type: PDF Article :
File Size: Pages 6
Reproduction Date: 2015

Title:	Coupling Path Influence on the Conducted Emission Measurement Results by the Emc Semiconductor Test Board : Volume 9, Issue 23 (01/08/2011)
Author:	Frick, M.
Volume:	Vol. 9, Issue 23
Language:	English
Subject:	Science, Advances, Radio
Collections:	Periodicals: Journal and Magazine Collection, Copernicus GmbH
Historic Publication Date:	2011
Publisher:	Copernicus Gmbh, Göttingen, Germany


Citation APA MLA Chicago Weigel, R., Eidher, R., & Frick, M. (2011). Coupling Path Influence on the Conducted Emission Measurement Results by the Emc Semiconductor Test Board : Volume 9, Issue 23 (01/08/2011). Retrieved from https://www.gutenberg.cc/

Description
Description: Engineering Electromagnetic Compatibility, Robert Bosch GmbH, Reutlingen, Germany. The fact of reduced development time in the automotive sector requires a change in the electromagnetic compatibility (EMC) validation of electronic components. To increase the development time of automotive components, e.g. sensors or electronic control units (ECUs), it is mandatory to verify the EMC behavior of the integrated circuit (IC) itself in an early development stage simultaneous to the development process of the entire ECU into which it is embedded. The conducted IC EMC tests emission as well as immunity is realized with a specific test printed circuit board (PCB) which is built according to the guidelines of the Bosch, Infineon, Siemens VDO Specification (BISS, 2007). The measurement results of these EMC tests are affected by the test PCB itself. To deduce the application requirements of the component from the application circuit of the test PCB it is necessary to consider this influence by the printed circuit board. The text at hand gives an overview on how far the emission results are adulterated by the used test PCB. The presented method also grants a validation of the disturbance voltage directly at the IC pin considering the application circuit.

Summary
Coupling path influence on the conducted emission measurement results by the EMC semiconductor test board

Excerpt
Berroth, M.: Vorlesungsskript, Theorie der Schaltungen III, Kapitel 4: Grundzuege der Vierpoltheorie, Institut fuer Elektrische und Optische Nachrichtentechnik, Universitaet Stuttgart, http://jfz.50g.com/files/tdslll-kapitel_4.pdf, October 2009.; BISS; \underlineBosch, \underlineInfineon, \underlineSiemens VDO \underlineSpecification: Generic IC EMC Test Specification 2004–2007.; Meinke, H. and Gundlach, F. W.: Taschenbuch der Hochfrequenztechnik, Hrsg. von Lange, K., Loecherer, K.-H., ISBN-10:3-540-54714~-2, Springer-Verlag, Fuenfte Auflage, 1992.; Michel, H.-J.: Zweitor-Analyse mit Leistungswellen, Studienbuecher Elektrotechnik, ISBN-10:3-519-06112-0, B. G. Teubner Stuttgart, 1981.; Paul, C. R.: Introduction to electromagnetic compatibility, ISBN-13: 978-0-471-75500-5, John Wiley & Sons Inc., second edition, 2006.





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